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Process Platform
Provide stable, reliable and advanced IGBT technical services
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模塊封裝簡介
采用業界先進的IGBT封裝工藝,包括真空焊接、鍵合、清洗、端子超聲、插針、灌膠以及測試等,技術參數達到業界領先水平,可根據客戶需求定制工藝研發和大規模生產方案。
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